RoHS / WEEE
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RoHS materials report, Certified by PRC Authorized Laboratory
SM7744DSV-133.333M | CMOS 5X7 OSC 25PPM 3.3V :
RoHS Compliant Status:
This component has been compliant since inception.
Hence, there is no special markings or indicators needed to show compliant devices.
Hence, there is no special markings or indicators needed to show compliant devices.
REACH Statement for PLE product
Pletronics, Inc. does not intentionally add any currently listed REACH SVHC material to its RoHS Compliant ceramic/metal cased parts.
Pletronics, Inc. does not use any currently listed REACH SVHC material in the manufacture of its RoHS Compliant ceramic/metal cased parts.
Pletronics, Inc. does not use any currently listed REACH SVHC material in the manufacture of its RoHS Compliant ceramic/metal cased parts.
Pletronics Inc. certifies this device is in accordance with RoHS (2002/95/EC) and WEEE (2002/96/EC) directives.
Moisture Sensitivity Level: 1 per IPC / JEDEC J-STD020D.1
Second Level Interconnect: e4 per JEDEC Standard JESD97
Second Level Interconnect: e4 per JEDEC Standard JESD97
Process Temperature Limits:
Maximum Reflow Temperature / Time: +260C / 10 Seconds Maximum per Pass / 3 Passes Maximum
CERAMIC 5X7mm 4 PAD CERAMIC PACKAGE
| Material | Mass | Homogeneous Content | Component Content | ||||
| Group | Substance | CAS# | g (mg) | % | PPM | % | PPM |
| CERAMIC | ALUMINUM OXIDE (Al2O3) | 1344-28-1 | 0.079821 (79.8210) | 90.50 | 905000 | 47.21 | 472143 |
| SILICON DIOXIDE (SiO2) | 7631-86-9 | 0.003087 (3.0870) | 3.50 | 35000 | 1.83 | 18259 | |
| CALCIUM OXIDE (CaO) | 1305-78-8 | 0.000529 (0.5292) | 0.60 | 5999 | 0.31 | 3130 | |
| MAGNESIUM OXIDE (MgO) | 1309-48-4 | 0.000441 (0.4410) | 0.50 | 5000 | 0.26 | 2608 | |
| CHROMIC OXIDE (Cr2O3) | 1308-38-9 | 0.003440 (3.4398) | 3.90 | 39000 | 2.03 | 20346 | |
| TITANIUM DIOXIDE (TiO2) | 13463-67-7 | 0.000882 (0.8820) | 1.00 | 10000 | 0.52 | 5217 | |
| Total: 0.088200 (88.2000) | |||||||
| SEAL RING | IRON (Fe) | 7439-89-6 | 0.012985 (12.9850) | 53.00 | 530000 | 7.68 | 76806 |
| NICKEL (Ni) | 7440-02-0 | 0.007105 (7.1050) | 29.00 | 290000 | 4.20 | 42026 | |
| COBALT (Co) | 7440-48-4 | 0.004410 (4.4100) | 18.00 | 180000 | 2.61 | 26085 | |
| Total: 0.024500 (24.5000) | |||||||
| SEAL RING ATTACH (BRAZE) | GOLD (Au) | 7440-57-5 | 0.006279 (6.2790) | 97.50 | 974999 | 3.71 | 37140 |
| COPPER (Cu) | 7440-50-8 | 0.000161 (0.1610) | 2.50 | 25000 | 0.10 | 952 | |
| Total: 0.006440 (6.4400) | |||||||
| ADHESION LAYER | TUNGSTEN (W) | 7440-33-7 | 0.004662 (4.6620) | 100.00 | 1000000 | 2.76 | 27575 |
| METALIZATION | GOLD (Au) | 7440-57-5 | 0.016020 (16.0198) | 98.90 | 989000 | 9.48 | 94757 |
| Nickel (Ni) | 7440-02-0 | 0.000178 (0.1782) | 1.10 | 11000 | 0.11 | 1053 | |
| Total: 0.016198 (16.1980) | |||||||
| CERAMIC 5X7mm 4 PAD CERAMIC PACKAGE
Weight: 0.140000g (140.0000mg) |
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METAL 5X7mm CERAMIC PACKAGE LID
| Material | Mass | Homogeneous Content | Component Content | ||||
| Group | Substance | CAS# | g (mg) | % | PPM | % | PPM |
| LID | IRON (Fe) | 7439-89-6 | 0.010300 (10.3000) | 51.50 | 515000 | 6.09 | 60924 |
| NICKEL (Ni) | 7440-02-0 | 0.006000 (6.0000) | 30.00 | 300000 | 3.55 | 35490 | |
| COBALT (Co) | 7440-48-4 | 0.003600 (3.6000) | 18.00 | 180000 | 2.13 | 21294 | |
| MOLYBDENUM (Mo) | 7439-98-7 | 0.000100 (0.1000) | 0.50 | 5000 | 0.06 | 591 | |
| Total: 0.020000 (20.0000) | |||||||
| METAL 5X7mm CERAMIC PACKAGE LID
Weight: 0.020000g (20.0000mg) |
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SILICON CHIP
| Material | Mass | Homogeneous Content | Component Content | ||||
| Group | Substance | CAS# | g (mg) | % | PPM | % | PPM |
| SILICON CHIP | DOPED SILICON (Si) | 7440-21-3 | 0.000080 (0.0800) | 100.00 | 1000000 | 0.05 | 473 |
| SILICON CHIP
Weight: 0.000080g (0.0800mg) |
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IC ATTACH ADHESIVE (CONDUCTIVE SILVER FILLED)
| Material | Mass | Homogeneous Content | Component Content | ||||
| Group | Substance | CAS# | g (mg) | % | PPM | % | PPM |
| IC ATTACH ADHESIVE | SILVER (Ag) | 7440-22-4 | 0.004200 (4.2000) | 70.00 | 700000 | 2.48 | 24843 |
| Silicone | PROPRIETARY | 0.001800 (1.8000) | 30.00 | 300000 | 1.06 | 10647 | |
| Total: 0.006000 (6.0000) | |||||||
| IC ATTACH ADHESIVE (CONDUCTIVE SILVER FILLED)
Weight: 0.006000g (6.0000mg) |
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IC BOND WIRE
| Material | Mass | Homogeneous Content | Component Content | ||||
| Group | Substance | CAS# | g (mg) | % | PPM | % | PPM |
| IC BOND WIRE | GOLD (Au) | 7440-57-5 | 0.000198 (0.1979) | 98.95 | 989450 | 0.12 | 1170 |
| BERYLLIUM (Be) | 7440-41-7 | 0.000000 (0.0000) | 0.00 | 24 | 0.00 | 0 | |
| CALCIUM (Ca) | 7440-70-2 | 0.000000 (0.0001) | 0.05 | 499 | 0.00 | 0 | |
| COPPER (Cu) | 7440-50-8 | 0.000000 (0.0003) | 0.15 | 1499 | 0.00 | 1 | |
| PALLADIUM (Pd) | 7440-05-3 | 0.000002 (0.0017) | 0.85 | 8499 | 0.00 | 10 | |
| SILVER (Ag) | 7440-22-4 | 0.000000 (0.0000) | 0.00 | 24 | 0.00 | 0 | |
| Total: 0.000200 (0.2000) | |||||||
| IC BOND WIRE
Weight: 0.000200g (0.2000mg) |
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QUARTZ CRYSTAL (RETANGULAR)
| Material | Mass | Homogeneous Content | Component Content | ||||
| Group | Substance | CAS# | g (mg) | % | PPM | % | PPM |
| CRYSTAL BLANK | QUARTZ (SiO2) | 14808-60-7 | 0.001326 (1.3260) | 100.00 | 1000000 | 0.78 | 7843 |
| CRYSTAL ELECTRODE | SILVER (Ag) | 7440-22-4 | 0.000154 (0.1544) | 99.63 | 996314 | 0.09 | 913 |
| CHROMIUM (Cr) | 7440-47-3 | 0.000001 (0.0006) | 0.37 | 3685 | 0.00 | 3 | |
| Total: 0.000155 (0.1550) | |||||||
| CRYSTAL ADHESIVE | SILVER (Ag) | 7440-22-4 | 0.001040 (1.0400) | 80.00 | 799999 | 0.62 | 6151 |
| SILICONE | 63394-02-5 | 0.000260 (0.2600) | 20.00 | 199999 | 0.15 | 1537 | |
| Total: 0.001300 (1.3000) | |||||||
| QUARTZ CRYSTAL (RETANGULAR)
Weight: 0.002781g (2.7810mg) |
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Total Component Weight:
0.169061g (169.0610mg)
Download Component Data into Excel
Download Substance Totals into Excel
| CAS# | Substance | Total Mass in Component g (mg) | % Total in Component | PPM |
| 1305-78-8 | CALCIUM OXIDE (CaO) | 0.000529 (0.5292) | 0.313 | 3130 |
| 1308-38-9 | CHROMIC OXIDE (Cr2O3) | 0.003440 (3.4398) | 2.035 | 20346 |
| 1309-48-4 | MAGNESIUM OXIDE (MgO) | 0.000441 (0.4410) | 0.261 | 2608 |
| 1344-28-1 | ALUMINUM OXIDE (Al2O3) | 0.079821 (79.8210) | 47.214 | 472143 |
| 13463-67-7 | TITANIUM DIOXIDE (TiO2) | 0.000882 (0.8820) | 0.522 | 5217 |
| 14808-60-7 | QUARTZ (SiO2) | 0.001326 (1.3260) | 0.784 | 7843 |
| 63394-02-5 | SILICONE | 0.000260 (0.2600) | 0.154 | 1537 |
| 7439-89-6 | IRON (Fe) | 0.023285 (23.2850) | 13.773 | 137731 |
| 7439-98-7 | MOLYBDENUM (Mo) | 0.000100 (0.1000) | 0.059 | 591 |
| 7440-02-0 | NICKEL (Ni) | 0.013283 (13.2832) | 7.857 | 78570 |
| 7440-05-3 | PALLADIUM (Pd) | 0.000002 (0.0017) | 0.001 | 10 |
| 7440-21-3 | DOPED SILICON (Si) | 0.000080 (0.0800) | 0.047 | 473 |
| 7440-22-4 | SILVER (Ag) | 0.005394 (5.3944) | 3.191 | 31908 |
| 7440-33-7 | TUNGSTEN (W) | 0.004662 (4.6620) | 2.758 | 27575 |
| 7440-41-7 | BERYLLIUM (Be) | 0.000000 (0.0000) | 0.000 | 0 |
| 7440-47-3 | CHROMIUM (Cr) | 0.000001 (0.0006) | 0.000 | 3 |
| 7440-48-4 | COBALT (Co) | 0.008010 (8.0100) | 4.738 | 47379 |
| 7440-50-8 | COPPER (Cu) | 0.000161 (0.1613) | 0.095 | 954 |
| 7440-57-5 | GOLD (Au) | 0.022497 (22.4967) | 13.307 | 133068 |
| 7440-70-2 | CALCIUM (Ca) | 0.000000 (0.0001) | 0.000 | 0 |
| 7631-86-9 | SILICON DIOXIDE (SiO2) | 0.003087 (3.0870) | 1.826 | 18259 |
| PROPRIETARY | Silicone | 0.001800 (1.8000) | 1.065 | 10647 |
- Additional Notes
-
Comment:
Pletronics Inc. certifies that the devices do not contain:
Asbestos
Asbestos Compounds
AZO Dyes
Cadmium (Cd)
Cadmium Compounds
Chlorofluorocarbons
Ethylene Glycol
Halogenated Dioxins
Flurans
Halons
Hexavalent Chromium (CrVI)
Lead (Pb)
Lead Compounds
Mercury (Hg)
Mercury Compounds
Monomethyl Ether and its' Acetates
Polybrominated Biphenyls (PBB's)
Polybrominated Diphenyl Ethers (PBDEs)
Polychorobiphenyls (PCBS)
Polychloroterphenyls (PCTS)