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SM7745DW-106.0M-30 | CMOS 5X7 OSC 50PPM 2.5V :

RoHS Compliant Status:

   
This component has been compliant since inception.
Hence, there is no special markings or indicators needed to show compliant devices.
   

REACH Statement for PLE product

   
Pletronics, Inc. does not intentionally add any currently listed REACH SVHC material to its RoHS Compliant ceramic/metal cased parts.
Pletronics, Inc. does not use any currently listed REACH SVHC material in the manufacture of its RoHS Compliant ceramic/metal cased parts.
   

Pletronics Inc. certifies this device is in accordance with RoHS (2002/95/EC) and WEEE (2002/96/EC) directives.

   
Moisture Sensitivity Level: 1 per IPC / JEDEC J-STD020D.1
Second Level Interconnect: e4 per JEDEC Standard JESD97
   

Process Temperature Limits:

   
Maximum Reflow Temperature / Time: +260C / 10 Seconds Maximum per Pass / 3 Passes Maximum
   

CERAMIC 5X7mm 4 PAD CERAMIC PACKAGE

Material Mass Homogeneous Content Component Content
Group Substance CAS# g (mg) % PPM % PPM
CERAMIC ALUMINUM OXIDE (Al2O3) 1344-28-1 0.079821 (79.8210) 90.50 905000 47.15 471467
SILICON DIOXIDE (SiO2) 7631-86-9 0.003087 (3.0870) 3.50 35000 1.82 18233
CALCIUM OXIDE (CaO) 1305-78-8 0.000529 (0.5292) 0.60 5999 0.31 3125
MAGNESIUM OXIDE (MgO) 1309-48-4 0.000441 (0.4410) 0.50 5000 0.26 2604
CHROMIC OXIDE (Cr2O3) 1308-38-9 0.003440 (3.4398) 3.90 39000 2.03 20317
TITANIUM DIOXIDE (TiO2) 13463-67-7 0.000882 (0.8820) 1.00 10000 0.52 5209
  Total: 0.088200 (88.2000)  
 
SEAL RING IRON (Fe) 7439-89-6 0.012985 (12.9850) 53.00 530000 7.67 76696
NICKEL (Ni) 7440-02-0 0.007105 (7.1050) 29.00 290000 4.20 41966
COBALT (Co) 7440-48-4 0.004410 (4.4100) 18.00 180000 2.60 26047
  Total: 0.024500 (24.5000)  
 
SEAL RING ATTACH (BRAZE) GOLD (Au) 7440-57-5 0.006279 (6.2790) 97.50 974999 3.71 37087
COPPER (Cu) 7440-50-8 0.000161 (0.1610) 2.50 25000 0.10 950
  Total: 0.006440 (6.4400)  
 
ADHESION LAYER TUNGSTEN (W) 7440-33-7 0.004662 (4.6620) 100.00 1000000 2.75 27536
 
METALIZATION GOLD (Au) 7440-57-5 0.016020 (16.0198) 98.90 989000 9.46 94622
Nickel (Ni) 7440-02-0 0.000178 (0.1782) 1.10 11000 0.11 1052
  Total: 0.016198 (16.1980)  
 
  CERAMIC 5X7mm 4 PAD CERAMIC PACKAGE Weight:
0.140000g (140.0000mg)
 

METAL 5X7mm CERAMIC PACKAGE LID

Material Mass Homogeneous Content Component Content
Group Substance CAS# g (mg) % PPM % PPM
LID IRON (Fe) 7439-89-6 0.010300 (10.3000) 51.50 515000 6.08 60837
NICKEL (Ni) 7440-02-0 0.006000 (6.0000) 30.00 300000 3.54 35439
COBALT (Co) 7440-48-4 0.003600 (3.6000) 18.00 180000 2.13 21263
MOLYBDENUM (Mo) 7439-98-7 0.000100 (0.1000) 0.50 5000 0.06 590
  Total: 0.020000 (20.0000)  
 
  METAL 5X7mm CERAMIC PACKAGE LID Weight:
0.020000g (20.0000mg)
 

SILICON CHIP

Material Mass Homogeneous Content Component Content
Group Substance CAS# g (mg) % PPM % PPM
SILICON CHIP DOPED SILICON (Si) 7440-21-3 0.000080 (0.0800) 100.00 1000000 0.05 472
 
  SILICON CHIP Weight:
0.000080g (0.0800mg)
 

IC ATTACH ADHESIVE (CONDUCTIVE SILVER FILLED)

Material Mass Homogeneous Content Component Content
Group Substance CAS# g (mg) % PPM % PPM
IC ATTACH ADHESIVE SILVER (Ag) 7440-22-4 0.004200 (4.2000) 70.00 700000 2.48 24807
Silicone PROPRIETARY 0.001800 (1.8000) 30.00 300000 1.06 10631
  Total: 0.006000 (6.0000)  
 
  IC ATTACH ADHESIVE (CONDUCTIVE SILVER FILLED) Weight:
0.006000g (6.0000mg)
 

IC BOND WIRE

Material Mass Homogeneous Content Component Content
Group Substance CAS# g (mg) % PPM % PPM
IC BOND WIRE GOLD (Au) 7440-57-5 0.000198 (0.1979) 99.79 997932 0.12 1168
BERYLLIUM (Be) 7440-41-7 0.000000 (0.0000) 0.00 25 0.00 0
CALCIUM (Ca) 7440-70-2 0.000000 (0.0001) 0.05 504 0.00 0
COPPER (Cu) 7440-50-8 0.000000 (0.0003) 0.15 1512 0.00 1
SILVER (Ag) 7440-22-4 0.000000 (0.0000) 0.00 25 0.00 0
  Total: 0.000198 (0.1983)  
 
  IC BOND WIRE Weight:
0.000198g (0.1983mg)
 

QUARTZ CRYSTAL (RETANGULAR)

Material Mass Homogeneous Content Component Content
Group Substance CAS# g (mg) % PPM % PPM
CRYSTAL BLANK QUARTZ (SiO2) 14808-60-7 0.001326 (1.3260) 100.00 1000000 0.78 7832
 
CRYSTAL ELECTRODE SILVER (Ag) 7440-22-4 0.000154 (0.1544) 99.63 996314 0.09 911
CHROMIUM (Cr) 7440-47-3 0.000001 (0.0006) 0.37 3685 0.00 3
  Total: 0.000155 (0.1550)  
 
CRYSTAL ADHESIVE SILVER (Ag) 7440-22-4 0.001040 (1.0400) 80.00 799999 0.61 6142
SILICONE 63394-02-5 0.000260 (0.2600) 20.00 199999 0.15 1535
  Total: 0.001300 (1.3000)  
 
  QUARTZ CRYSTAL (RETANGULAR) Weight:
0.002781g (2.7810mg)
 

0201 CHIP CAPACITOR-COG

Material Mass Homogeneous Content Component Content
Group Substance CAS# g (mg) % PPM % PPM
BODY (SUBSTRATE) BARIUM TITANATE (BaTiO3) 12047-27-7 0.000212 (0.2116) 90.51 905080 0.13 1250
NICKEL (Ni) 7440-02-0 0.000022 (0.0222) 9.49 94919 0.01 131
  Total: 0.000234 (0.2338)  
 
CONTACT WITH CERAMIC BARRIER PLATING SOLDER PLATING COPPER (Cu) 7440-50-8 0.000004 (0.0043) 42.49 424882 0.00 25
NICKEL (Ni) 7440-02-0 0.000001 (0.0012) 12.21 122065 0.00 7
TIN 100% (Sn) 7440-31-5 0.000005 (0.0046) 45.31 453051 0.00 27
  Total: 0.000010 (0.0102)  
 
  0201 CHIP CAPACITOR-COG Weight:
0.000244g (0.2441mg)
 

Total Component Weight:
0.169303g (169.3033mg)
Download Component Data into Excel

Download Substance Totals into Excel

CAS# Substance Total Mass in Component g (mg) % Total in Component PPM
12047-27-7 BARIUM TITANATE (BaTiO3) 0.000212 (0.2116) 0.125 1250
1305-78-8 CALCIUM OXIDE (CaO) 0.000529 (0.5292) 0.313 3125
1308-38-9 CHROMIC OXIDE (Cr2O3) 0.003440 (3.4398) 2.032 20317
1309-48-4 MAGNESIUM OXIDE (MgO) 0.000441 (0.4410) 0.260 2604
1344-28-1 ALUMINUM OXIDE (Al2O3) 0.079821 (79.8210) 47.147 471467
13463-67-7 TITANIUM DIOXIDE (TiO2) 0.000882 (0.8820) 0.521 5209
14808-60-7 QUARTZ (SiO2) 0.001326 (1.3260) 0.783 7832
63394-02-5 SILICONE 0.000260 (0.2600) 0.154 1535
7439-89-6 IRON (Fe) 0.023285 (23.2850) 13.753 137534
7439-98-7 MOLYBDENUM (Mo) 0.000100 (0.1000) 0.059 590
7440-02-0 NICKEL (Ni) 0.013307 (13.3066) 7.860 78596
7440-21-3 DOPED SILICON (Si) 0.000080 (0.0800) 0.047 472
7440-22-4 SILVER (Ag) 0.005394 (5.3944) 3.186 31862
7440-31-5 TIN 100% (Sn) 0.000005 (0.0046) 0.003 27
7440-33-7 TUNGSTEN (W) 0.004662 (4.6620) 2.754 27536
7440-41-7 BERYLLIUM (Be) 0.000000 (0.0000) 0.000 0
7440-47-3 CHROMIUM (Cr) 0.000001 (0.0006) 0.000 3
7440-48-4 COBALT (Co) 0.008010 (8.0100) 4.731 47311
7440-50-8 COPPER (Cu) 0.000166 (0.1656) 0.098 978
7440-57-5 GOLD (Au) 0.022497 (22.4967) 13.288 132878
7440-70-2 CALCIUM (Ca) 0.000000 (0.0001) 0.000 0
7631-86-9 SILICON DIOXIDE (SiO2) 0.003087 (3.0870) 1.823 18233
PROPRIETARY Silicone 0.001800 (1.8000) 1.063 10631

  • Additional Notes
  • Comment:
    Pletronics Inc. certifies that the devices do not contain:
    Asbestos
    Asbestos Compounds
    AZO Dyes
    Cadmium (Cd)
    Cadmium Compounds
    Chlorofluorocarbons
    Ethylene Glycol
    Halogenated Dioxins
    Flurans
    Halons
    Hexavalent Chromium (CrVI)
    Lead (Pb)
    Lead Compounds
    Mercury (Hg)
    Mercury Compounds
    Monomethyl Ether and its' Acetates
    Polybrominated Biphenyls (PBB's)
    Polybrominated Diphenyl Ethers (PBDEs)
    Polychorobiphenyls (PCBS)
    Polychloroterphenyls (PCTS)